interface between the process level (I/O level) and the higher-level fieldbus.
The I/O system 1000 is suitable for the implementation of complex automation applications consisting of the following components: bus coupler module, I/O compound modules, and backplane bus.
Lenze · I/O system 1000 · Reference Manual · DMS 6.0 EN · 12/2020 · TD06
Modular system
Dimensions
• I/O compound module 109 × 76.5 × 12.5 mm • Bus coupler module 109 × 76.5 × 48.5 mm
Mounting on standard DIN rail (35 mm)
Shield connection to standard metal rail (10 × 3 mm)
The two-piece structure (separation of electronics and process integration) enables a quick exchange of modules in the event of service
Wiring level via spring terminal (max. 1.5 mm2)
Operation at DC 24 V (DC 20.4 … DC 28.8 V)
Supply voltage of electronics and process level are separated
Number of I/O compound modules
• A bus coupler can contain up to 64 modules
Individual labelling by insertable labels (item designation) Electrical wiring diagrams are directly printed on the module Electrical isolation to the fieldbus and the process level Creation of electrical isolations by power supply modules
Weight | 0,8 kg |
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Dimensions | 9,5 × 2,50 × 7,5 cm |